OmniVision reveals innovative CMOS architecture

In partnership with Taiwan Semiconductor Manufacturing Corporation, OmniVision has developed a new CMOS sensor which enables the further miniaturization of digital imaging technology.

The OmniBSITM architecture extends the pixel roadmap down to 0.9 pixels through the use of backside illumination (BSI).

This method involves turning the CameraChip sensor upside down, so that it collects light through the silicon substrate which is on the back of the sensor in conventional designs.

As well as providing the opportunity for further miniaturization, the OmniBSITM architecture is also said to make the sensor more sensitive and efficient, providing enhanced performance and allowing a larger aperture size.