The USB Implementers Forum and the USB 2.0 Promoter Group, have jointly announced the availability of the High Speed Inter-Chip (HSIC) 1.1 specification, a supplementary specification to USB 2.0.
HSIC 1.1 supports chip to chip communications at 480Mbps. This will boost the performance of 3G and 4G handsets, smartphones and set-top boxes.
The new specification is designed to meet the increasing bandwith requirements of these devices and allow multiple high speed capabilities, such as 3G/4G modems, WiMAX and 802.11n to be easily integrated.
The specification improves the efficiency of data transfers, using less power and therefore preserving battery life.
Mobile devices supporting the new technology should be available in 2008. The specification is compatible with existing USB software stacks and is available online at http://www.usb.org/developers/docs/docs.