The AMD Taiwan Embedded Forum was this week the venue for an announcement from AMD regarding a series of additions to its embedded systems portfolio.
The company has said that the energy-efficient AMD Sempron processor 3700+ offers increased consistent performance and super low-power thermal envelope for value-based designs, whilst the AMD Turion 64 X2 dual-core TL-56 and TL-62 processors achieve the designer-requested low power and 64-bit application performance in the point-of-sale, industrial control, and digital signage embedded markets.
AMD has announced that a new chipset, based on the AMD 690 series, has also been added to the portfolio. The new AMD M690E allows greater flexibility and customization for display design, whilst further enabling high definition playback for embedded application video content.
The company has added that a new version of the Mobile AMD Sempron processor 2100+, available thanks to the implementation of advanced AMD manufacturing process technology improvements, delivers a 15% reduction in TDP. AMD further offered equipment manufacturers a COM Express form factor reference design kit, a toolset that allows OEMs to quickly design high quality graphic, performance, and I/O throughput embedded systems.
The company was quick to highlight that all of these new products feature support the same Socket S1, which allows developers faster delivery times through platform life-span and socket consistency. AMD also reminded users that these products, currently available, can be obtained through the AMD Longevity Program.