Wireless chipset specialist, Ralink Technology has announced that its 802.11n Plus Bluetooth Combo has completed Bluetooth 3.0 + HS qualification by the Bluetooth Qualification Board.
Ralink claims that the RT3090BC4 solution provides unprecedented performance and intelligent coexistence between Wi-Fi and Bluetooth technologies.
The product targets notebooks, netbooks and high-volume consumer PC platforms.
It gives wireless mobile products from partners such as MSI Computing of Taiwan enhanced multimedia capability by enabling Bluetooth 3.0+HS with data rates of up to 150Mbps, without losing the simplicity of Bluetooth device detection and setup.
“We are pleased to expand our partnership with Ralink into the fast growing mobile PC market,” said Jean Huand, Senior VP of MSI.
“With its advanced R&D and early investment in the ‘next generation’ of Bluetooth/Wi-Fi co-location technology, Ralink is far ahead of its competition with this Bluetooth 3.0 + HS certified 802.11n plus Bluetooth combo module for PCs”.
Last month Ralink reported first-quarter revenue growth and said it would ramp production of new Bluetooth chips in the second quarter.